The information provided is a guideline only of Tin-Lead and Tin Alloys and Lead Alloys. Your profile will depend upon many factors including customer requirements, and component limitations, oven characteristics and board layout, etc. And, quality requirements should drive the process, not adherence to these guidelines. Ideally, profile measurements are to be collected on a populated assembly and reflow profile recorded of each product being processed.

It is common for the same profile settings to be used for multiple assemblies and lines. Reflow profile data should be collected and analyzed and recorded for each assembly part number at the beginning of individual production runs and reflows.

Wetting issues, whether component (lead-free) or substrate related can be improved through profiling. If the wetting issue is global, it can often be improved with proper profiling technique. If the wetting issue is component specific, it is likely a plating issue with the component/substrate. Profiling can be manipulated to improve wetting, but may affect other devices on the assembly. A general approach is to shorten the profile to as little as three (3) minutes and to increase the peak temperature by 10-15°C.